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Conduit — Trade Show Identity & Booth System
Project type
Brand Identity, Packaging & Environmental Design
Date
July 2026
Location
Indianapolis, IN
Exhibition booth system for Conduit, a fictional B2B data infrastructure brand. The mark is built as an open channel, exposed connection points on both ends, standing in for data flowing in from any source and out to any destination. That idea carries through the booth's integrations diagram and panel system.
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